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技術(shù)支持員英文簡歷

時(shí)間:2020-08-27 17:31:10 英文簡歷模板 我要投稿

技術(shù)支持員英文簡歷精選

  還在為如何寫英文簡歷而憂愁嗎,其實(shí)只要找對了方法英文簡歷并不難,下面,YJBYS小編為大家推薦一份技術(shù)支持員英文簡歷精選范文,供大家參考借鑒,希望能夠幫到大家。

技術(shù)支持員英文簡歷精選

技術(shù)支持員英文簡歷精選

  minjun lu

  curriculum vita

  room 1903, guangzhou zhou central sub-branch of the people's bank of china

  zhengzhou, henan, 50040 china

  @diyifanwen.com

  ducation

  20xx-09 ~ 20xx-06 jiangxi normal university the application of electronic technology technical school

  training

  20xx-09 ~ 20xx-09 asm technology shenzhen asm xtreme wire bonder training

  20xx-06 ~ 20xx-09 changan asat semiconductor assembly and test plant eagle 60 welding wire machine training asat(utac) certificate

   work experience

  (XX-05 ~ XX-04)

  company type: private enterprise company category: electrical,micro-electronics

  job title: equipment engineer positions: chief engineer

  job description: in the lite-on group under the silitek electronic (guangzhou) co., ltd., is responsible for the wb asm series and ks series welding machine machine and debugging in cob workshop, all kinds of problems and timely treatment machine in the production process, so that normal production. training assessment on line operator, assist manager to make work instruction, make improvement on various problems during production, and submit the proposals to improve the electronic file

  reason for leaving: come home to development www.diyifanwen.com

  project experience

  changan asat semiconductor assembly and test plant (XX-06 ~ XX-10)

  job title: equipment technician

  project description: XX5 june to XX november in changan asat semiconductor assembly and test plant (now call utac) for more than five years, the factory for chip packaging enterprises, long-term production of various packaging chips, such as fpbga tpga ebga lpcc tapp qfp. i plant welding line department (wire bond) do technician team leader, has more than five years of chip manufacturing working experience, familiar with the former process and packaging technology, understand the chip manufacturing process. job five years through long-term of study and practice has a weld line solid theoretical foundation and rich practical experience, proficient in welding line chip machine (especially asm eagle60), can solve various problems of machine in the production process. there are multiple lines, long lines, super low line, multiple grains, some grains multilayer die, multilayer welding and bsob welding wires problem as well as a variety of production process of difficult miscellaneous diseases. proficient in olp production. for the machine maintenance, repair and maintenance of i also very familiar with, for the repair and maintenance of production equipment have many years of work experience. i also line technician leader, responsible for the long-term production management area, grass-roots staff management capability of the production line

  responsibility: asm wire bonder related work

  special skills

  professional title:

  computer level: national computer exam. grade 3

  computer skills:

  strengths: eight years wire bonding working experience, familiar with the asm and kns series wire bonders

  language skills

  chinese: good cantonese: good

  english level: spoken general

  english: general

  career objective

  career direction: wire bonding machine related work

  self info.

  self assessment:

  for people: honest, generous, warm and cheerful

  work: diligent, good cooperation, rigorous style of work

  strong adaptability and self-learning ability,

  strong management, organizational ability

  hobbies: surf the internet,play games,listen to the music,sports

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